In 2024, PACK EXPO International is a packaging and processing show, connecting more end users with more suppliers and more innovation than anywhere else you can imagine. 40+ vertical industries and 2,500 exhibitors under one roof! Join us in Chicago, Illinois on November 3-6, 2024. 

• Booth 5449 | Systems and Ingredient Automation | Coperion, Shick Esteve, and the former Schenck Process FPM that is now Coperion
• Booth 6124 | Mixing, Baking, Forming, Dividing, Dosing | VMI, Diosna, Peerless, Shaffer, Baker Perkins, Unifiller, and Bakon